توانمندی های تولید مدار چاپی
Layers count: 50
Min Line width/spacing(mil): 3.0/3.0
Max Aspect Ratio: 40:1
Board thickness(mil): 0.2mm~8.0mm
Max Panel size: 22.5″* ۴۹″= ۵۷ cm* 124 cm
Material: FR-4,High Tg FR-4,Halogen free,High Frequency
(Rogers,Arlon,Taconic,Nelco…)etc.
Surface Treatment: HASL,ENIG,ENEPIG,Immersion Silver,Immersion Tin,Flash Gold,Golden Finger,OSP,Lead free HASL etc.
Rigid-Flex Board
Mass production capacity for high density rigid-flex board fabrication
Layer Count/flex layer: ۳۶/۱۰
Min Line width/spacing for inner layer(mil): ۳٫۰/۳٫۰
Max Aspect Ratio: 20:1
Min Hole size(mil): 6
Impedance control:10%
HDI
۳+C+3: Mass production
۴+C+4:Small volume﹠Mass production
Laser via(Plugging via):Mass production
Min microvia hole size(mil) :۴
Metal substrate board
Layers count:Metal substrate: 1-12L
Embedded metal/Heat sink/Sweat bonding: 2-24L
Ceramic substrate: 1-2L
Board thickness :۰٫۵-۷٫۰mm
Size:max:610*610 mm ,min:5*5mm
Mechanic: X/Y/Z tolerance±۰٫۰۳mm, speaker hole, screw hole
Thermal conductivity: Standard materials: 1-4W/m.k,
Specified materials : 5-12W/m.k
Ceramic materials: 24-170W/m.k
Max copper thickness:۲۸OZ
Metal partial surface treatment: Anodic oxidation, Hard anodic oxidation coating, Chemical passivation, Sandblasting, Wire drawing, Al electroplating
Surface treatment: Leaded HASL/Lead free HASL, OSP, ENIG, ENEPIG, Plating(Ni)Soft/Hard gold,Immersion Sn, immersion silver, Organic Coating
Type: Pre-bonding, Postbonding, Sweat bonding, Metal substrate, Embedded metal, Heatsink, Ceramic substrate