توانمندی های تولید مدار چاپی

Layers count: 50
Min Line width/spacing(mil): 3.0/3.0
Max Aspect Ratio: 40:1
Board thickness(mil): 0.2mm~8.0mm
Max Panel size: 22.5″* ۴۹″= ۵۷  cm* 124   cm
Material: FR-4,High Tg FR-4,Halogen free,High Frequency
(Rogers,Arlon,Taconic,Nelco…)etc.
Surface Treatment: HASL,ENIG,ENEPIG,Immersion Silver,Immersion Tin,Flash Gold,Golden Finger,OSP,Lead free HASL etc.

Rigid-Flex Board

Mass production capacity for high density rigid-flex board fabrication
Layer Count/flex layer:  ۳۶/۱۰
Min Line width/spacing for inner layer(mil):  ۳٫۰/۳٫۰
Max Aspect Ratio: 20:1
Min Hole size(mil): 6
Impedance control:10%

HDI

۳+C+3: Mass production

۴+C+4:Small volume﹠Mass production

Laser via(Plugging via):Mass production

Min microvia hole size(mil) :۴

Metal substrate board

Layers count:Metal substrate: 1-12L

                     Embedded metal/Heat sink/Sweat bonding: 2-24L

                     Ceramic substrate: 1-2L

Board thickness :۰٫۵-۷٫۰mm

Size:max:610*610 mm ,min:5*5mm

Mechanic: X/Y/Z tolerance±۰٫۰۳mm, speaker hole, screw hole

Thermal conductivity: Standard materials: 1-4W/m.k,

                               Specified materials : 5-12W/m.k

                               Ceramic materials: 24-170W/m.k

Max copper thickness:۲۸OZ

Metal partial surface treatment: Anodic oxidation, Hard anodic oxidation coating, Chemical passivation, Sandblasting, Wire drawing, Al electroplating

Surface treatment: Leaded HASL/Lead free HASL, OSP, ENIG, ENEPIG, Plating(Ni)Soft/Hard gold,Immersion Sn, immersion silver, Organic Coating

Type: Pre-bonding, Postbonding, Sweat bonding, Metal substrate, Embedded metal, Heatsink, Ceramic substrate